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| PD - 9.1040 IRGPC30FD2 INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE Features * Switching-loss rating includes all "tail" losses * HEXFREDTM soft ultrafast diodes * Optimized for medium operating frequency (1 to 10kHz) See Fig. 1 for Current vs. Frequency curve C Fast CoPack IGBT VCES = 600V VCE(sat) 2.1V G @VGE = 15V, IC = 17A E n-channel Description Co-packaged IGBTs are a natural extension of International Rectifier's well known IGBT line. They provide the convenience of an IGBT and an ultrafast recovery diode in one package, resulting in substantial benefits to a host of high-voltage, high-current, motor control, UPS and power supply applications. TO -2 47AC Absolute Maximum Ratings Parameter VCES IC @ TC = 25C IC @ TC = 100C I CM ILM IF @ TC = 100C IFM VGE PD @ TC = 25C PD @ TC = 100C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Diode Continuous Forward Current Diode Maximum Forward Current Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec. Mounting Torque, 6-32 or M3 Screw. Max. 600 31 17 120 120 12 120 20 100 42 -55 to +150 300 (0.063 in. (1.6mm) from case) 10 lbf*in (1.1 N*m) Units V A V W C Thermal Resistance Parameter RJC RJC RCS RJA Wt Junction-to-Case - IGBT Junction-to-Case - Diode Case-to-Sink, flat, greased surface Junction-to-Ambient, typical socket mount Weight Min. ------------------------- Typ. ----------0.24 ----6 (0.21) Max. 1.2 2.5 -----40 ------ Units C/W g (oz) IRGPC30FD2 Electrical Characteristics @ TJ = 25C (unless otherwise specified) Parameter Min. Collector-to-Emitter Breakdown Voltage 600 V(BR)CES /T J Temperature Coeff. of Breakdown Voltage---Collector-to-Emitter Saturation Voltage ---VCE(on) ------Gate Threshold Voltage 3.0 VGE(th) V GE(th)/TJ Temperature Coeff. of Threshold Voltage---Forward Transconductance 6.1 gfe ICES Zero Gate Voltage Collector Current ------Diode Forward Voltage Drop ---V FM ---Gate-to-Emitter Leakage Current ---IGES V(BR)CES Typ. ---0.69 1.8 2.4 2.2 ----11 10 ------1.4 1.3 ---Max. Units Conditions ---V VGE = 0V, IC = 250A ---- V/C VGE = 0V, IC = 1.0mA 2.1 IC = 17A VGE = 15V ---V IC = 31A See Fig. 2, 5 ---IC = 17A, TJ = 150C 5.5 VCE = VGE, IC = 250A ---- mV/C VCE = VGE, IC = 250A ---S VCE = 100V, IC = 17A 250 A VGE = 0V, VCE = 600V 2500 VGE = 0V, VCE = 600V, TJ = 150C 1.7 V IC = 12A See Fig. 13 1.6 IC = 12A, TJ = 150C 100 nA VGE = 20V Switching Characteristics @ TJ = 25C (unless otherwise specified) Min. Typ. Max. Units Conditions ---27 30 IC = 17A ---- 4.1 5.9 nC VCC = 400V ---12 15 See Fig. 8 ---72 ---TJ = 25C ---75 ---ns IC = 17A, VCC = 480V ---- 300 450 VGE = 15V, RG = 23 ---- 220 350 Energy losses include "tail" and ---- 0.9 ---diode reverse recovery. ---- 2.1 ---mJ See Fig. 9, 10, 11, 18 ---- 3.0 4.6 ---70 ---TJ = 150C, See Fig. 9, 10, 11, 18 ---75 ---ns IC = 17A, VCC = 480V ---- 420 ---VGE = 15V, RG = 23 ---- 480 ---Energy losses include "tail" and ---- 4.7 ---mJ diode reverse recovery. ---13 ---nH Measured 5mm from package ---- 670 ---VGE = 0V ---- 100 ---pF VCC = 30V See Fig. 7 ---10 --- = 1.0MHz ---42 60 ns TJ = 25C See Fig. 14 IF = 12A ---80 120 TJ = 125C Irr Diode Peak Reverse Recovery Current ---- 3.5 6.0 A TJ = 25C See Fig. 15 VR = 200V ---- 5.6 10 TJ = 125C Q rr Diode Reverse Recovery Charge ---80 180 nC TJ = 25C See Fig. 16 di/dt = 200A/ ---- 220 600 TJ = 125C s di(rec)M/dtDiode Peak Rate of Fall of Recovery ---180 During t b ---120 ---A/s TJ = 25C See Fig. ---TJ = 125C 17 Notes: VCC=80%(V CES), VGE=20V, L=10H, Pulse width 5.0s, Repetitive rating; VGE=20V, pulse width RG = 23, ( See fig. 19 ) single shot. limited by max. junction temperature. ( See fig. 20 ) Pulse width 80s; duty factor 0.1%. Qg Qge Q gc t d(on) tr t d(off) tf Eon Eoff Ets t d(on) tr t d(off) tf Ets LE Cies Coes Cres t rr Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time IRGPC30FD2 20 Duty cycle: 50% TJ = 125C Tsink = 90C Gate drive as specified Turn-on losses include effects of reverse recovery Power Dissipation = 24W 16 Load Current (A) 12 60% of rated voltage 8 4 0 0.1 1 10 A 100 f, Frequency (kHz) Fig. 1 - Typical Load Current vs. Frequency (Load Current = IRMS of fundamental) 1000 1000 I C, Collector-to-Emitter Current (A) IC , Collector-to-Emitter Current (A) TJ = 25C 100 100 TJ = 150C 10 TJ = 150C TJ = 25C 1 10 1 1 VGE = 15V 20s PULSE WIDTH 10 0.1 5 10 VCC = 100V 5s PULSE WIDTH 15 20 VCE , Collector-to-Emitter Voltage (V) VGE , Gate-to-Emitter Voltage (V) Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics IRGPC30FD2 40 VGE = 15V 3.5 VGE = 15V 80s PULSE WIDTH IC = 34A VCE , Collector-to-Emitter Voltage (V) Maximum DC Collector Current (A) 3.0 30 2.5 20 I C = 17A 2.0 10 1.5 I C = 8.5A 0 25 50 75 100 125 150 1.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 TC , Case Temperature (C) TC , Case Temperature (C) Fig. 4 - Maximum Collector Current vs. Case Temperature Fig. 5 - Collector-to-Emitter Voltage vs. Case Temperature 10 Thermal Response (Z thJC ) 1 D = 0.50 0.20 0.10 P DM 0.1 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) t 1 t 2 Notes: 1. Duty factor D = t 1 /t 2 0.01 0.00001 2. Peak TJ = PDM x Z thJC + T C 0.0001 0.001 0.01 0.1 1 10 t 1 , Rectangular Pulse Duration (sec) Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case IRGPC30FD2 1400 VGE , Gate-to-Emitter Voltage (V) 100 1200 V GE = 0V, f = 1MHz Cies = Cge + C gc , Cce SHORTED Cres = C gc Coes = Cce + C gc 20 VCE = 400V I C = 17A 16 C, Capacitance (pF) 1000 Cies 800 12 Coes 600 8 400 Cres 200 4 0 1 10 0 0 5 10 15 20 25 30 V CE , Collector-to-Emitter Voltage (V) Q g , Total Gate Charge (nC) Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage 3.10 Total Switching Losses (mJ) 3.06 Total Switching Losses (mJ) VCC = 480V VGE = 15V T C = 25C I C = 17A 100 RG = 23 V GE = 15V V CC = 480V I C = 34A 10 I C = 17A I C = 8.5A 1 3.02 2.98 2.94 0 10 20 30 40 50 A 60 0.1 -60 -40 -20 0 20 40 60 80 A 100 120 140 160 R G , Gate Resistance () TC , Case Temperature (C) Fig. 9 - Typical Switching Losses vs. Gate Resistance Fig. 10 - Typical Switching Losses vs. Case Temperature IRGPC30FD2 12 9 I C , Collector-to-Emitter Current (A) Total Switching Losses (mJ) RG = 23 T C = 150C VCC = 480V VGE = 15V 1000 VGE = 20V GE TJ = 125C 100 SAFE OPERATING AREA 6 10 3 0 0 10 20 30 A 40 1 1 10 100 1000 IC , Collector-to-Emitter Current (A) VCE , Collector-to-Emitter Voltage (V) Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current 100 Fig. 12 - Turn-Off SOA Instantaneous Forward Current - I F (A) TJ = 150C 10 TJ = 125C TJ = 25C 1 0.4 0.8 1.2 1.6 2.0 2.4 Forward Voltage Drop - V FM (V) Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current IRGPC30FD2 160 100 VR = 200V TJ = 125C TJ = 25C 120 VR = 200V TJ = 125C TJ = 25C I F = 24A I F = 12A 80 I IRRM - (A) I F = 24A 10 t rr - (ns) I F = 12A IF = 6.0A I F = 6.0A 40 0 100 di f /dt - (A/s) 1000 1 100 di f /dt - (A/s) 1000 Fig. 14 - Typical Reverse Recovery vs. dif/dt Fig. 15 - Typical Recovery Current vs. dif /dt 600 10000 VR = 200V TJ = 125C TJ = 25C VR = 200V TJ = 125C TJ = 25C 400 di(rec)M/dt - (A/s) 1000 Q RR - (nC) IF = 6.0A I F = 24A I F = 12A I F = 12A 100 200 IF = 6.0A I F = 24A 0 100 di f /dt - (A/s) 1000 10 100 di f /dt - (A/s) 1000 Fig. 16 - Typical Stored Charge vs. dif/dt Fig. 17 - Typical di(rec)M /dt vs. dif/dt IRGPC30FD2 90% Vge +Vge Same type device as D.U.T. Vce Ic 80% of Vce 430F D.U.T. 10% Vce Ic 90% Ic 5% Ic td(off) tf Eoff = t1+5S Vce ic dt t1 Fig. 18a - Test Circuit for Measurement of ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf t1 t2 Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining Eoff, td(off), tf GATE VOLTAGE D.U.T. 10% +Vg +Vg trr Ic Qrr = trr id dt tx tx 10% Vcc Vce Vcc 10% Ic 90% Ic DUT VOLTAGE AND CURRENT Ipk Ic 10% Irr Vcc Vpk Irr td(on) tr 5% Vce t2 Eon = Vce ie dt t1 t2 DIODE REVERSE RECOVERY ENERGY t3 DIODE RECOVERY WAVEFORMS t4 Erec = Vd id dt t3 t1 t4 Fig. 18c - Test Waveforms for Circuit of Fig. 18a, Defining Eon, td(on), tr Fig. 18d - Test Waveforms for Circuit of Fig. 18a, Defining Erec, trr, Qrr, Irr IRGPC30FD2 Vg GATE SIGNAL DEVICE UNDER TEST CURRENT D.U.T. VOLTAGE IN D.U.T. CURRENT IN D1 t0 t1 t2 Fig. 18e - Macro Waveforms for Test Circuit of Fig. 18a L 1000V 50V 6000F 100V Vc* D.U.T. R L= 0 - 480V 480V 4 X IC @25C Fig. 19 - Clamped Inductive Load Test Circuit 15.90 (.626) 15.30 (.602) -B3.65 (.143) 3.55 (.140) 0.25 (.010) M D B M - A5.50 (.217) 20.30 (.800) 19.70 (.775) 1 2 3 -C- D- Fig. 20 - Pulsed Collector Current Test Circuit 5.30 (.209) 4.70 (.185) 2.50 (.089) 1.50 (.059) 4 NOTES: 1 DIMENSIONS & TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION : INCH. 3 DIMENSIONS ARE SHOWN MILLIMETERS (INCHES). 4 CONFORMS TO JEDEC OUTLINE TO-247AC. 2X 5.50 (.217) 4.50 (.177) LEAD ASSIGNMENTS 1 - GATE 2 - COLLECTOR 3 - EMITTER 4 - COLLECTOR * 14.20 (.559) 2.40 (.094) 2.00 (.079) 2X 5.45 (.215) 2X 14.80 (.583) 4.30 (.170) 3.70 (.145) * LONGER LEADED (20mm) VERSION AVAILABLE (TO-247AD) 0.80 (.031) 3X 0.40 (.016) 2.60 (.102) 2.20 (.087) TO ORDER ADD "-E" SUFFIX TO PART NUMBER 1.40 (.056) 3X 1.00 (.039) 0.25 (.010) M 3.40 (.133) 3.00 (.118) CAS CONFORMS TO JEDEC OUTLINE TO-247AC (TO-3P) Dimensions in Millimeters and (Inches) |
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